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Reballing Challenges

General
Process  BGA
Handling  StencilQuik™
Method  EZReball™
Method  High Volume
Method Dry
Packaging Ceramic
Package Reballing Challenges
 Optional
Services

The reballing of BGAs come with some challenges and  therefore should not be attempted by inexperienced users unless properly trained-especially in the case of sensitive devices, expensive components or very high ball count components. BEST is knowledgeable in IEC TS 62647-4 standards for the restoration of BGAs, In addition cleanliness standard testing, ball shear testing, co-planarity testing and XRF testing are services BEST can perform post BGA reballing.

Popcorned BGAPopcorned BGA

Other challenges regarding BGA reballing include:
  • Component damage due to improper reflow temperature
  • Improper temperature profile
  • Ceramic part reballing-paste printing onto select areas of the PCB lands

Warped BGAProfile of Warped BGA

Each of these problem areas may be mitigated by either having properly trained personnel or by using a professional contract rework facility such as BEST perform the work.