BGA Reballing Challenges
There are some common areas inexperienced BGA assembly technicians may run into in the reworking of BGAs including:
Popcorning and component damage -this is particularly prevalent on very thin devices (MSD Class 1):
Other challenges regarding BGA reballing include:
- Component damage due to improper reflow temperature
- Improper temperature profile
- Ceramic part reballing-paste printing onto select areas of the PCB lands
Each of these problem areas may be mitigated by either having properly trained personnel or by using a professional contract rework facility such as BEST perform the work.