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In Solder Rework/Repair, Solder Training and Tools

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X-Ray Capabilities

BEST has a multitude of X-Ray capabilities to suit your contract non-destructive x-ray testing capabilities. To detect today’s complex microelectronic joints high resolution (1 micron) high magnification (100X to 5.000X), complex sample manipulation (to tilt and rotate the PCB or the imaging system), and sophisticated image-processing software is required. The BEST x-ray system is capable of providing all of these features.

X-Ray Capabilities
  • Ultra-fast acquisition of X-ray scans
  • Integrated display and analysis tools
  • Measure on screen & annotate data
X-Ray Image Analysis and Enhancement
  • Image processing filters (sharpen, smooth, edge detect, emboss, background subtract, etc)
  • Inspection tools (e.g. BGA void recognition, void calculation of BGAs, PTH hole fill)
Productivity Capabilities
  • Component specific automated pass/fail analysis
  • HTML report generation
  • AXI based on fiducial recognition to augment visual or AOI inspection
  • View surface mount defects i.e. misaligned devices, solder joint porosity, bridging
  • Detailed inspection of vias, through hole plating and multi-layer alignment
Electrical and Electronic Component Defect Detection Capabilities
  • Broken wedge bonds
  • Lifted ball bonds
  • Wire sweep
  • Die attach
X-Ray Inspection of MEMs

In today's world increasingly miniaturised electronic products, Microelectromechanical systems (MEMS) and Nanoelectromechanical systems (NEMS) are ultra miniature sensors found in electronics products. Although these devices are typically produced using techniques analogous to those found in the semiconductor industry such as photolithography and various deposition processes. At these sub miniature scales inspection is essential for process diagnostics, troubleshooting and quality control.

Description:

The applications for MEMS includes but is not limited to the following:

  • brake sensors
  • accelerometers
  • actuators
  • cantilevers
  • gyroscopes
  • airflow sensors
  • micronozzles for inkjet printers

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WHAT'S NEW?

ARTICLE: Multiple Methods for Applying Paste Flux or Solder Paste for BGA Rework

ARTICLE: IPC-A-620 Gets a Facelift

 

 

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