BEST Prototype Calculator Terms Defined Quantity of Boards to be Populated Refers to the number of PCBs you would like us to assemble. This online calculator can accommodate a maximum of 200 boards. Placements Per Board This is the total number of devices that will be soldered to the PCB. The online calculator can accommodate a maximum of 500 placements. If your requirement is greater than 500 pcs please phone BEST at (847) 797-9250 to discuss your requirements or use the quote request form found here. BGA A Ball Grid Array device (BGA for short). These are SMT devices will ball interconnects. BEST uses X-Ray and endoscopic inspection of all underside solder joints. CBGA A Ceramic Ball Grid Array device (CBGA for short). These are SMT devices with ball interconnects. BEST uses X-Ray and endoscopic inspection of all underside solder joints. QFN A Ceramic Ball Grid Array device (QFN for short). These are SMT devices with all underside of device. BEST uses X-Ray inspection of all underside solder joints. Thru-Hole The total number of thru-hole parts. An example would be an Ethernet board level connector. SMT Passives The total number of passive SMT devices which typically includes resistors and capacitors, etc. SMT Actives The total number of active SMT devices which typically SOICs, triacs, etc. SMT Fine Pitch The total number of SMT devices that have a spacing of 20 mils or less from lead center to lead center are considered fine pitch SMT devices. Close Window