LGA Rework Services

BEST provides sound rework solutions for LGA and leadless devices such as QFNs and other MLFs. Our engineers have developed better processes to make LGA rework more repeatable, consistent and reliable. In fact, BEST engineers were instrumental in proposing several new IPC procedures for the rework of these device types. We have been reworking LGAs, QFNs and other MLF packages for many years, and continue to stay current with the latest package styles and techniques to rework them.LGA Rework

We have numerous "high end" LGA rework systems and have the right experiences and the right tools for the job. Rework or initial LGA, QFN or MLF placements for prototype work is performed by IPC-certified technicians who have been specifically trained for leadless device rework and who inspect their work with the latest in QC tools such as endoscopes and X-ray imaging . Each job is returned to you with a disc of the appropriate x-ray image.



Repair of damaged solder mask between LGA pads is a task our experienced repair technicians face on a daily basis. Damaged or missing LGA pads are replaced by following an IPC recommended procedure. This procedure uses specially designed replacement copper BGA pads that are bonded to the board surface with a 2-part epoxy.


The key to successful LGA, QFN and MLF rework is the proper solder paste printing of the land areas. It developed a unique flexible, one time used adhesive-backed Stencil-StikNPeel ™ BEST has the experience to properly design the stencils, even when large ground planes exist on the device. In addition BEST has the ability to bump the lands of the devices using its patented StencilQuikâ„¢ stencil printing technique.

BEST provides services including leadless component removal, site prep, replacement, salvage, x-ray or optical verification, circuit design changes, as well as pad, trace and mask repair.

Our IPC Master Certification Center also offers certification classes in LGA, QFN and MLF rework and technical support.

To find out more about placing QFN Packages QFN Assembly Reliability (.PDF file)

Let our experience work for you!

Contact B.E.S.T. Today!

 

 





 

To find out more about BGA packages, and the assembly and rework of BGA's, please see;
(PDF files)

LGA Application Note 1
LGA Application Note 2
LGA Application Note 3

Circuit Assembly's 2006 Service Excellence Award

 
3603 Edison Place - Rolling Meadows, IL 60008 - Phone 847.797.9250 - Fax 847.797.9255
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