Best Prototype/Micro OEM Build Capabilities Lead-free as well as standard eutectic processes Populating devices as small as 0.5 x 1.0mil Populating fine pitch devices to 0.25mm pitch Populating 0.4mm pitch CGA, PBGA and CSP area array devices Populating through-hole parts such as multi-pin connectors and odd-form parts Inspection capabilities to IPC 610 requirements CLASS 1, 2 or 3 including the newest lead-free requirements Complex PCB rework and repair of PCBs including base board laminate, pad/trace repair or modification Reballing and repair of BGAs XRAY, microscopic and endoscopic inspection of area array packages "Box build" and other mechanical assembly Functional testing Inclusion and mass copying/packaging of instruction manuals for products IC programming

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