Dealing Wirh PCB Process Debug Problems


Process Debug Problems

Process Debug
BEST offers a variety of analytical lab services along with its process expertise to the debugging of a process or assisting in the validation of a process. BEST offers dye and pry testing which will help you determine if the interface between a component and solder joint or solder joint to PCB is compromised.

Process Troubleshooting



In addition BEST offers microsectioning services along with professional advice in getting to the root of process problems as many defects in electronic assemblies are hidden from view. Some types of defects are visible but their extent can only be realized when microsectioning of the suspect area is done.

Not only do you get these analytical services from BEST but most importantly you get the years of experience in helping to debug PCB manufacturing problems.

 





 

To find out more about BGA packages, and the assembly and rework of BGA's, please see;
(PDF files)

LGA Rework & Assembly 1
LGA Rework & Assembly 2
LGA Rework & Assembly 3
LGA Rework & Assembly 4

Circuit Assembly's 2006 Service Excellence Award

 
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