BEST’s laser ablation process does not burn or melt coatings, but instead removes them from substrates by breaking the molecular bonds of the coating material using a laser coating removal process. Properly performed laser ablation results in a clean substrate that is unharmed and a border between coated and uncoated regions that is perfectly uniform, free of burrs, strands, and discoloration. Another distinguishing capability is the removal of coatings from sites plated with soft metals such as gold and tin/lead. BEST is able to remove coatings using a variety of guided laser sources while leaving the underlying plated metals intact and without heat effects (“orange-peeling”). This is important when circuit boards need their coatings removed from termination and test sites and wire-bond pads.
A common example of this application would be the selective removal of parylene in selected locations on a coated device. Parylenes are a family of unique polymer coatings that offer superior barrier, thermal, optical, electrical, and mechanical properties. BEST can use its laser to selectively ablate Parylene coatings. We can remove Parylene from tin, gold, nickel, copper, tungsten and other surfaces without harming the substrate. Furthermore, BEST can remove Parylene from piece parts that range in size and shape from large printed circuit boards to small electrical probes. Our experienced staff has the know how to perform precise selective ablation of Parylene thereby avoiding the manual masking and removal techniques that can add cost and compromise part quality. BEST’s laser ablation service saves labor and is highly repeatable and is well-suited for complex part selective coating removal.
- Coating Removal: On these type of products
- Parylenes: Fiber Optic Cable
- Polyacrylates: Medical Guide Wires
- Polyimides: Printed Circuit Boards
- Teflons: Test Probes
Call BEST today to discuss your laser coating removal application.