Adhesive-backing prevents solder from squirting underneath the stencil thereby eliminating multiple reworks Squeezes in to tight spaces as made from flexible mylar film with repositionable adhesive allowing you to print more easily on heavily-populated boards Simplifies printing process as multiple passes insure proper fill of apertures and a more consistent print volume

Simplifies BGA rework as balls can fit tactily in to the stencil aperatures greatly simplifying BGA rework Repairs solder mask damage thereby saving repair time Prevents balls from shorting one to another

Allows much simpler placement of leadless devices like QFNs and LGAs Reduction in voiding as devices are “bumped” prior to placement Much faster and consistent rework of leadless devices

Ruggedized stencils are cost effective for large rework projects Most cost effective rework stencil type