Ezreball Evaluation Kit
EZReball™ Speed up Device Reballing
Your BEST Source for PCB Rework and Repair Tools
Benefits:
- Simple to use reballing preform
- High first pass yield
- No tooling costs for new patterns
- Ability to reball down to 0.15mm pitch and 6 mil ball sizes
Each evaluation kit offers the following:
- BGA sample component
- EZReball™ preform to match component
- Instructions
What you will need to reball a device:
- Soldering iron w/tip (chisel tip is preferred)
- Soldering wick
- Paste flux –water soluble
- Soft bristled brush to clean device post reflow
- Reflow source
- Inspection optics
