The EZReball™ process simplifies BGA and other area array device reballing. Simply "square up" the perfectly fitting preform to the package being reballed preform on bottom with balls side up, run it through a reflow source and remove! After cleaning you will have a reballed device. It is that simple! No special forms and no paper remnants to remove.
The EZreball™ reballing technique can be described in a single word-simple! It is designed to have someone who has an never reballed a device to quickly replace balls on a BGA package. The edges of the preform are aligned with the package being reballed thereby eliminating the need for custom fixture or frames. The balls are firmly held in place until after reflow thereby reducing the problem of missing solder balls found in the paper preform process. Post reflow the preform is simply peeled away eliminating the time required in cleaning off residual paper used in other methods.
Packaged and delivered to you just the way you want the EZReball™ preforms are made to your specifications. There are no tooling costs associated with new designs. They are packaged in quantities such that developers and prototype builders will find them easy to use
EZReball™ preforms have been described by users as elegant, simple and best of easy-to-use. A specialty high temperature rated film laser machined with the correct pattern aligns the balls in the right location, The balls are aligned through these apertures and held in place using an engineered adhesive system. The preform captures and retains the solder ball using a specialty adhesive, The preform is simply "peeled" off after reflow. EZReball™ reballing preforms are packaged in groups of (15) in a small antistatic bag.