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Ezreball Evaluation Kit

EZReball™ Speed up device reballing

Your BEST Source for PCB Rework and Repair Tools
 
Benefits:
  • Simple to use reballing preform
  • High first pass yield
  • No tooling costs for new patterns
  • Ability to reball down to 0.15mm pitch and 6 mil ball sizes

Each evaluation kit offers the following:

  • BGA sample component
  • EZReball™ preform to match component
  • Instructions

What you will need to reball a device:

  • Soldering iron w/tip (chisel tip is preferred)
  • Soldering wick
  • Paste flux –water soluble
  • Soft bristled brush to clean device post reflow
  • Reflow source
  • Inspection optics
Ezball

EZReball



EZReball™ SPEEDS DEVICE REBALLING down to 0.35mm pitch!
bga rework mini-micro smt stencil solutions
1. Dress Site and Clean
Paste flux or solder paste stencil kits
2. Apply Paste Flux
metal stencils, solder paste stencils, bga stencils, mini stencils, micro stencils.
3. Align and Place BGA on to Preform
stencil quik, stencilquik, StencilQuik, flextec stencils
4. Post Reflow and Preform Removal
 
 
EZReball From BEST allows repair technicians to reliably and quickly replace balls on a BGA package.
Reballing Kits

EZReball™
See how

EZReball ™ can speed up device reballing.

EZReball™

 

See how

EZReball ™ can speed up ceramic reballing.


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The EZReball™ process simplifies BGA and other area array device reballing. Simply "square up" the perfectly fitting preform to the package being reballed preform on bottom with balls side up, run it through a reflow source and remove! After cleaning you will have a reballed device. It is that simple! No special forms and no paper remnants to remove.

The EZreball™ reballing technique can be described in a single word-simple! It is designed to have someone who has an never reballed a device to quickly replace balls on a BGA package. The edges of the preform are aligned with the package being reballed thereby eliminating the need for custom fixture or frames. The balls are firmly held in place until after reflow thereby reducing the problem of missing solder balls found in the paper preform process. Post reflow the preform is simply peeled away eliminating the time required in cleaning off residual paper used in other methods.

Packaged and delivered to you just the way you want the EZReball™ preforms are made to your specifications. There are no tooling costs associated with new designs. They are packaged in quantities such that developers and prototype builders will find them easy to use

EZReball™ preforms have been described by users as elegant, simple and best of easy-to-use. A specialty high temperature rated film laser machined with the correct pattern aligns the balls in the right location, The balls are aligned through these apertures and held in place using an engineered adhesive system. The preform captures and retains the solder ball using a specialty adhesive, The preform is simply "peeled" off after reflow. EZReball™ reballing preforms are packaged in groups of (15) in a small antistatic bag.

Order your FREE EZReball™ evaluation kit here.

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WHAT'S NEW?

ARTICLE: Bumping of QFNs, LGAs, and other Leadless Devices

ARTICLE: To Bake or Not to Bake (in Rework)

 

 

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