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October 2007

 

Greetings!
This issue of the BEST newsletter breaks from tradition in that this one is covering a single announcement- the release of a newly-patented solder preform method for reballing BGAs.------EZReball(TM).
BEST has been working on this development for over 25 months as various brainstorming sessions, many trial and errors, on the road with consultants and vendors, lots of internal product testing in the services area mixed with pure BEST tenacity have made this product a reality. We therefore decided that the announcement of the our EZReball(TM) solder reballing preform should stand on its own in this newsletter.

  in this issue

The following are just some of the values EZReball(TM) brings to the reballing user community :
Ability to to quickly reball devices
Simplicity of the process
Small minimum quantity purchase requirement with NO tooling charges for custom patterns
The personal touch of the BEST customer care team


Call us with questions about the product or the process (or to order your first packet and have a chance to WIN the GPS!).
Bob Wettermann BEST Inc.

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Newly Patented Method for Reballing Devices

The new BEST EZReball(TM) solder reballing preform provides a new way to quickly and easily reball devices.

This method is a quick way to attach balls onto a device. The simple 1-2-3-4 method as pictured on web site or in our instructional video shows how quickly a device can be reballed.

The reballing process using the EZReball(TM) preform can be done very quickly. After dressing the pads simply place paste flux on the bottom of the device. Align by squaring up the engineered preform to the corresponding pads. Place the device into the properly-profiled heat source. After being cooled simply peel off the preform, clean and inspect. Its like a Post-it(TM) note with solder balls !

Since nothing in terms of customized fixtures is required almost anyone can now reball devices. As long as attention to the process steps, even those technicians never having reballed a device can attach solder balls to rework a device!

 
EZReball -Unique Value Proposition

There are several compelling reasons why you should begin using these preforms to reball your devices :

This method is clean. There are no messy paper remnants to wipe away. Peel the preform away and clean the flux off of the bottom of the device. The method is fast . The preforms are cut such that they can be "squared up" to the package being reballed using the edges of the package for alignment, thereby eliminating the need to mechanically fixture a reballing tool to the device. This means you can reball the devices much more quickly!

The EZReball(TM) packaging includes a QC stencil along with each package of preforms. This allows you to easily check for 100% ball placement as well as facilitating faster rework of single balls

The EZReball(TM) preform can accommodate ball diameters below 14 mils. BEST has reballed devices using the EZReball(TM) preform with solder balls as small as 12mils in diameter with a 0.5mm pitch!

One of the intangible, yet known values you will get with each EZReball(TM) purchase is the BEST service level. The BEST staff knows who pays the bills and we continually strive for the the best in class customer service. Our award-winning service means that you will be treated fairly, promptly and with courtesy. You do not have have to stand for second-class service levels in dealing with a vendor in this product area. Demand the BEST!

Consistent Results with EZReballing Process

The EZReball(TM) process had to pass stringent BEST criteria prior to its release to the general rework audiences. BEST has been using this technique for several months as part of its reballing service business having reballed thousands of BGAs already using this technique. In addition, there are several analytical tests that BEST has performed that have confirmed the process and end product consistency.

One of the test results that verified the high level of process yields was verified in the ball diameter and z axis height measurements. See for yourself in the link below as the consistency of these two parameters is confirmed by external lab results directed to in the link below. EZReball(TM) dall diameter and z height report

SOLDERING TIPS

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