Highlighted in this newsletter are several of the newest
pieces of information on the BEST web site along with
our newest products and services.
Also check out the "change of pace" article we have
included. It will tell you tinkerers out there just how
to build your own SMT solder extraction tool. It is
truly a "homemade" version!
On June 8th BEST will be celebrating its 10th
Anniversary. Put the date on your calendar as there will
be quite a party!
Bob Wettermann, President
Lead Free BGA Study Results Now Available
Recently BEST commissioned a study which
compared the reliability of various lead-free
BGA rework methods. The results were presented
at the recent Pan Pac Exposition and at APEX.
They are now available in both their presented
paper form as well as in the lab test results
version.
This study was commissioned to compare paste
printing and flux only rework attachment methods
and the impact that they would have on the
reliability of lead-free processed BGAs. Each of
the samples were tested for the reliability of
their interconnections as they were subjected to
1,000+ temperature cycles.
The results of this study showed:
First pass rework yields of flux attachment
are lower than solder paste printing
The reliability of lead-free reworked BGAs
is not impacted by the presence of the
StencilQuik(TM) stay-in-place stencil
BEST has available IPCA-610 CIT and CIS
re-certifications without ever having to leave
the comfort of your home or office. It is easy
to use and little computer expertise is
required! These online re-certifications offer:
The elimination of travel for the testing:
The flexibility of taking the test wherever
you want
The ability to have students test at various
times so as not to dedicate a trained, skilled
soldering trainer for re-certifications
Please find attached a link to the demo sight
for the A610 recertification. Just click through
to see what the interface would look like for
your students. Both CIS and CIT
re-certifications are available.
BEST has had numerous experiences with leadless
device initial placement and rework. We have the
right experiences and the right tools for the
job.
The key to successful LGA, QFN and MLF rework is
the proper solder paste printing of the land
areas. BEST has the experience to properly
design the stencils, even when large ground
planes exist on the device. In addition, our
technicians can "bump” the device lands using
the StencilQuik(TM) stencil printing technique.
We have gathered a variety of resources on
our web site so that you can learn more about
the placement and rework of these package types.
See the link below......
Interested in Making Your Own Solder Extraction
Tool?
Some people just love to tinker. Soldering
technicians and electronics hobbyists are no
different. If you are tired of paying higher
than expected prices for your desoldering
equipment, you can "make your own".
All you will need is the following:
Radio-Shack de-soldering Iron ($10)
Small fish tank air pump ($7)
Six to eight feet of vinyl fish tank air
hose ($1)