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June 2006

 
Highlighted in this newsletter are some tips on dealing with mask repair and reballing of lead-free area array devices. A newer time-saving method for BGA mask damage repair is highlighted.

Also, in one of our newsletter sections below check out the information with respect to the lead-free RoHS initiative . There are some very compelling technical and financial reasons for not going along blindly !

On June 8th BEST will be celebrating its 10th Anniversary with a "10 BEST bars " party. Check out some of our newest capabilities for prototype builds and board and part marking. Help us celebrate by enjoying the bars we will have prepared for you including the fruit , cigar , candy and martini and wine "bars" as well as munching on the pig roast fixings. The festivities run from 3:30 to 7:00PM. RSVPs are due to Laura Ripoli by June 2nd !!!! Hope to see you there!

CktBdAnimated
Bob Wettermann, President

in this issue
Fast Mask Repair Underneath BGAs

If solder mask is damaged or missing in the area of the board in the area of BGA or CSP land patterns there is a fast way to repair this damage that does not involve the time-consuming method of hand touching up by hand the area between the BGA pads.
By placing the StencilQuik(TM) stencil over the BGA site it will prevent the solder from migrating down the dogbones to the vias. The two 2 dimensional X-ray images on the left clearly demonstrate the mask repair properties of StencilQuik(TM). In both cases the mask was completely stripped from two test vehicle boards. The upper image shows the ball patterns of a BGA reworked using StencilQuik(TM). Note the uniformity of the solder ball patterns. In the second image a traditional metal stencil was used to apply the solder paste pattern to the board. Note the areas in which solder shorts occurred and where the solder went down the dogbone to the via, thereby starving the solder joint.
By simply placing the StencilQuik(TM) over the damaged sites, solder mask can be quickly repaired thereby saving the significant time required to repair mask damage underneath BGAs.
Find out more about StencilQuik(TM)

BGA Repair-Reballing of Lead-Free Parts

In the transition to a lead free BGA environment several companies are running into the problem of a shortage in the supply of either tin-lead balled area array devices or SAC alloy devices. In either case BEST can be of assistance.
In order to prevent mixed-alloy situations on a circuit board it is generally the safest bet to stick to a single alloy with repsect to solder balls and solder paste. This insures that a single reflow temperature will be used to mitigate the problems associated with inconsistent solder melt or component or PCB laminate damage. In addition, the intermetallic layers will be controlled for the strongest possible interconnection.
BEST has significant experience in dealing with the reballing of either tin-lead or "lead free" solder balled parts and changing them over to other another alloy. Care must be taken to make sure that the parts are properly prepped and the remnant solder of the tinned lead bearing solder pads are "rinsed" to a degree to allow for the balls to attach to the solder paste without contaminating the lead free device.
To see more about BGA reballing

Lead Free Backlash

Below are some viewpoints about the environmental "friendliness" or lack thereof of lead-free solders.

Lead-free solder has reliability challenges, which may (or may not) be resolved given time, including the impact of new termination platings on the components themselves. It has also soaked up tens of billions of dollars in areas such as capital equipment, re-design, materials research and standards generation.

Secondly, the most valuable (non-renewable) resource has been in engineering bandwidth, which has been locked up for five years or more in the run up to the European Union's Restriction of Hazardous Substances (RoHS) lead ban in solders. Most importantly, removing lead in solder will actually have a negative impact on the environment, and was not necessary for any public safety or environmental considerations, or based on any published data in the first place.

The latest EPA report on Solders in Electronics: A life-cycle assessment , published August 2005, has some very interesting data. It shows that the most widely used replacements for "leaded" solder, generally referred to as "SAC alloy", has a greater environmental impact than tin/lead solder in a number of key areas such as non-renewable resource use, energy use, global warming, ozone depletion and water quality. See more myths about lead-free solders debunked here

More BEST information

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phone: (847) 797-9250
web: http://www.solder.net

SOLDERING TIPS

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Newsletter

WHAT'S NEW?

ARTICLE: Multiple Methods for Applying Paste Flux or Solder Paste for BGA Rework

ARTICLE: IPC-A-620 Gets a Facelift

 

 

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