|Highlighted in this newsletter are some tips on dealing with mask repair and reballing of lead-free area array devices. A newer time-saving method for BGA mask damage repair is highlighted. |
Also, in one of our newsletter sections below check out the information with respect to the lead-free RoHS initiative . There are some very compelling technical and financial reasons for not going along blindly !
On June 8th BEST will be celebrating its 10th Anniversary with a "10 BEST bars " party. Check out some of our newest capabilities for prototype builds and board and part marking. Help us celebrate by enjoying the bars we will have prepared for you including the fruit , cigar , candy and martini and wine "bars" as well as munching on the pig roast fixings. The festivities run from 3:30 to 7:00PM. RSVPs are due to Laura Ripoli by June 2nd !!!! Hope to see you there!
|Fast Mask Repair Underneath BGAs|
If solder mask is damaged or missing in the area of the board in the area of BGA or CSP land patterns there is a fast way to repair this damage that does not involve the time-consuming method of hand touching up by hand the area between the BGA pads.
|BGA Repair-Reballing of Lead-Free Parts|
In the transition to a lead free BGA environment several companies are running into the problem of a shortage in the supply of either tin-lead balled area array devices or SAC alloy devices. In either case BEST can be of assistance.
|Lead Free Backlash|
Below are some viewpoints about the environmental "friendliness" or lack thereof of lead-free solders.
Lead-free solder has reliability challenges, which may (or may not) be resolved given time, including the impact of new termination platings on the components themselves. It has also soaked up tens of billions of dollars in areas such as capital equipment, re-design, materials research and standards generation.
Secondly, the most valuable (non-renewable) resource has been in engineering bandwidth, which has been locked up for five years or more in the run up to the European Union's Restriction of Hazardous Substances (RoHS) lead ban in solders. Most importantly, removing lead in solder will actually have a negative impact on the environment, and was not necessary for any public safety or environmental considerations, or based on any published data in the first place.
The latest EPA report on Solders in Electronics: A life-cycle assessment , published August 2005, has some very interesting data. It shows that the most widely used replacements for "leaded" solder, generally referred to as "SAC alloy", has a greater environmental impact than tin/lead solder in a number of key areas such as non-renewable resource use, energy use, global warming, ozone depletion and water quality. See more myths about lead-free solders debunked here
|More BEST information|
phone: (847) 797-9250