Thanks to those who helped celebrate our 10 year
anniversary. Over 150 guests including our much
appreciated customers, vendors, neighbors and friends
helped to celebrate our first decade as well as usher in
the next 10 years.
In this newsletter you will find tips on reworking RF
shields and on how to streamline your BGA reballing
procurement process. We are also thrilled that we can
make available to you FLASH versions of the renowned
BEST Soldering Tip videos so that you can immediately
see these informative and instructional videos.
Wishing you a safe and happy summer!
Bob Wettermann, President
Complete Source for Reballed BGAs
In the transition to a "lead-free" electronics
assembly world, many BGAs are no longer
available in a Sn63 alloy. This has presented a
challenge to OEM builders as well as contract
manufacturers in procuring "leaded" BGAs.
BEST has now integrated a one stop service for
providing reballed parts as a finished assembly
part number. After procuring the parts for the
OEM builder or EMS company, BEST performs the
reballing service and provides them back to the
assembler in labeled, ESD-safe
hermetically-sealed packaging. This has
eliminated the need for the contract EMS
provider or the OEM to procure the parts,
receive them, send them out for reballing and
relabel them. All of these services are
performed by one company under a single purchase
order.
Call Laura Ripoli at BEST for your unique
requirements on these turnkey part procurement
and reballing services @ 847-797-9250.
Hints on Placement of RF Shield Cans
If you are having difficulty reworking RF
shielded parts then BEST can be your outsourcing
rework partner.
RF shields are difficult to rework. Many times a
perfect solder joint integrity must be present
for the "can" to be effective in its usage. In
addition, oxides formed on the can lip may
prevent it from being a "good" solderable
surface.
Problems in RF shield rework can be overcome by
:
1. Making sure that you always start with a
"fresh" or new can when putting a replacement
device onto the circuit board. This will make
sure that a "good" solderable surface is
available as during reflow process the "cans"
are oxidized.
2. Insuring that the pad outline for the can
is "pre bumped" with solder to allow for a more
uniform solder fillet around the can lip. NOTE:
When removing the can insure that the it is
heated in a uniform manner using a
properly-sized nozzle so as to not burn the
board.
After listening to user inputs, BEST has now
made available its popular Soldering Tip videos
in a flash format. With a broadband connection
and an up-to-date computer, these video files
can now be immediately played without delay as
there are no video players to load.
Still available are the BEST Soldering Tips in
the most popular RealPlayer and Windows Media
formats. This allows trainers and instructors to
use these free hand soldering and PCB repair
tips in their classroom training programs.
BEST, in conjunction with the SMTnet, is hosting
a forum discussion group on PCB assembly issues
on its web site at
www.solder.net . Some of the latest issues
discussed include the processing conditions for
SACX vs SAC100 lead free alloys for wave
soldering, RoHS compliance issues and BGA
reballing. We invite you to post a question
and/or contribute to the discussions.