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February 2008

 

Dear Subscriber;

In this edition of the BEST newsletter we are pleased to tell you about:

* Reworking Underfilled Components
* BEST Teaches Reballing Session at APEX
* The Possibilities in the Ford Model "U" Concept Car

In addition to teaching at APEX,  BESTs' IPC Master instructor Ray Cirimele will be leading a session on lead free rework at the upcoming IPC Reliability and Repair Symposium. Check out the link on the left column to find out more information.

More news next month!
CktBdAnimated

Bob Wettermann
President, BEST Inc

Solder Tips
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BEST Video Soldering Tips

NEW-TSOP 32 Drag Soldering Video

BEST Instructors have put together video demonstrations of common hand soldering tips and skills. These are not designed to be in place of live one on one training where repetitive skills and subsequent one on one feedback is given. Rather, they are quick refreshers designed to be viewed if a specific skill has not been practiced in a while. 

 
Reworking Underfilled Components


The goal of underfilled component rework is to remove the underfilled device and replace it with a good part WITHOUT board damage. The removal of this material can be accomplished with a combination of mechanical grinding or through high temperature vacuum extraction or laser ablation depending on the modulus of elasticity and the softening temperature of the underfill.

The rework process begins with the even heating of the substrate to a temperature above the softening  point of the underfill. The package is mechanically gripped or pried with enough torque to break the fillet's adhesions to the board. The chip undergoing rework is then heated above the solder  reflow temperature to melt the solder connections and break down the underfill. The device is then removed from the PCB.  Residual solder and underfill are cleaned off the substrate.  Cleanup after chip removal removes any underfill residue and excess solder on the substrate.  This part of the process must be done with extreme care in order to not damage the pads and adjacent components on the substrate. The site is then cleaned prior to inspection. Once cleanup of the substrate is complete, a new chip can be aligned, reflowed, and underfilled.

Call Laura Ripoli at (847) 797-9250 to see how we can assist with your removal and replacement process.

 
 

Register at APEX for PD-48 Practical Tips for Reballing Devices to be held on  Monday  March  31, 2008 from 2:00-5:00 PM. BEST instructors will be teaching this class.

 

Ford's Model "U"- Advanced "Green" and Electronics Meet

Ford's Model "U" can be a cause for excitement of the potential for the US Auto industry if some of these "concept" features make it to the showroom. It features the the following possibilities.

  • Hydrogen ICE plus Hybrid Electric Powertrain - A 2.3-liter, four-cylinder supercharged, intercooled hydrogen internal combustion engine, coupled with a hybrid electric transmission, propels the Model U. It offers enhanced fuel economy - the equivalent of 45 miles per gallon and about 300 miles of range - plus near-zero regulated emissions and a 99-percent reduction in carbon dioxide.
  • Conversational Speech Interface - Model U showcases an advanced conversational speech technology. It allows a person to speak naturally to operate on-board systems including entertainment, navigation, cellular telephone and climate control.
  • Improved Driver Visibility and Awareness through Active Safety - Model U features pre-crash sensing, adaptive front headlights and an advanced night vision system to help the driver avoid accidents before they occur.

More on the Model "U" concept here .

 
TABLE OF CONTENTS
 
Underfilled Component Rework
APEX
Ford's Forward Thinking
 
QUICK LINKS
 
EZReball Eval Kit
BEST Capabilities Video
PCB Repair Kits and Parts
Proto Assembly Estimator
IPC Rework Symposium
 
ASK THE EXPERT
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BEST's "Ask the Expert" column is designed to give one-one dialogue between a questioner and our master instructor Kris Roberson. Specification, processing and inspection questions are asked and answered here.

 
PRODUCTS & SERVICES
 
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The BEST PCB repair kit give you the tools you need for fast repair and modification of lands, traces, contact fingers, SMT pads, plated hole connections and PCB base board material. 

 

BEST INDUSTRY FORUMS
 

This Industry forum is a discussion area where opninons are given on equipment and processes, help is goven on process problems and  resources for proble-solving and troubleshooting are shared.

 
WISCONSIN SMTA CHAPTER MEETING
 

The Wisconsin SMTA  will be holding a meeting at the Waukesha Technical College on Thursday March 20th starting at 6:00PM. There will be a tour of the facility as well as a presentation on CAMX productivity software  by Andrew Dugenske of the Georgia Institute of Technology. More info here.

 

SOLDERING TIPS

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Newsletter

WHAT'S NEW?

ARTICLE: Multiple Methods for Applying Paste Flux or Solder Paste for BGA Rework

ARTICLE: IPC-A-620 Gets a Facelift

 

 

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