|
Greetings!
This summer we
have been working on a NEW SMT assembly class to teach engineers and
technicians about SMT electronics assembly. The first "alpha" class is
scheduled for the last week in August with new classes starting in the
fall.
We hope to see you at the new IPC Midwest show being held in
Chicago in September or at one of the IPC standards sessions or at the
Friday September 28th session on rework where we have lined up an
interesting panel of rework presentations. Also, we invite you to see us
in October at the SMTAI in sunny Florida where can learn first hand about
device reballing.
The following
topics are covered in this end-of-summer newsletter:
- Invitation to the IPC Midwest Lead Free Rework Session
- Invitation to the SMTAI Practical Reballing Tutorial
- Info on the new BEST SMT Assembly Class
- NASA Learns About Soldering in Space
Have a safe
and fun summer!!!!!
Bob Wettermann BEST Inc.
|
|
Lead
Free Rework and Repair at IPC Midwest |
 |
Don't forget
to sign up for the IPC Midwest show taking place in Chicago the
week of September 28. Make sure to sign up for Session S12 entitled
"Rework and Repair: If You HAVE to Fix It".
This session
will focus on repair and rework, particularly in the area of lead free.
Below are the session speakers and their topics:
Adding Lead Free
to IPC-7711/21
Daniel Foster, STI Electronics, Inc.
Effects of BGA Rework Cycles on PCB Assembly Reliability
Jin Liang, EMC Corporation
Efficient Thermal Transfer for
Lead Free Hand Soldering
Ray Cirimele, B E S T Inc.
Helium - Light Gas for Heavy Duty Lead Free Rework
Mark
Walz, VJ Electronix
Package on Package Rework for Lead Free
Ian Orpwood, OK International
QFN Rework Challenges in a Lead
Free World
Neil O'Brien, Finetech, Inc.
|
|
Learn
How to Reball -SMTAI Orlando Florida |
|
Make sure to
get your hands-on training with respect to reballing practices at SMTAI in Orlando Florida. Two of our master instructors will be
leading a hands-on session on reballing. Look for Tutorial T4 entitled "Reballing Area Array Devices - A Practical Workshop". This
will be held on October 7th from 1:30pm - 5:00pm.
This course
is designed for those who want to learn the "tricks of the trade" with
respect to BGA/CSP reballing. After a ¾ hour introductory session on
various aspects of solder ball attachment, profiling and part handling,
you will learn first-hand various reballing techniques. This
hands-on session will cover the aspects of reballing using performs,
metal stencils, or polyimide stencils. Inspection and JEDEC part
requirements will be discussed.
|
|
NEW !
BEST SMT Assembly Class |
|
The BEST SMT
Assembly Class is now ready for its unveiling. There is a vast array of
manufacturing experiences within our instructor staff ready to instruct
students. This program is designed to educate students on the many
different processes and materials used in mixed technology operations .
It is a pragmatic, hands-on intensive one week program that provides
students with the opportunity to learn, practice and understand the
processes, tools, and materials used to properly manufacturing
electronic assemblies. Teaching takes place at BEST in Rolling Meadows
IL as well as other SME (Subject Matter Experts)s at the various places
of business which are in close proximity to BEST.
The course
is designed to teach students through classroom lectures, hands-on
experiences both at BEST as well as surrounding commercial businesses.
The goal is to provide students with in-class lecture as well hands-on
lab time. The labs allow the opportunity for students to immediately
apply the lessons learned during lecture. The latest manufacturing and
processing equipment as well as techniques are featured in the
class.
Call us
today to discuss your SMT assembly class requirements at (847) 797-9250
and ask for Katy Radcliff.
|
|
Soldering in Space? |
|
(Above) Scanning electron micrograph (SEM) image of the ISSI sample. Note the
considerable, large and small porous holes in the sample
The In-space Soldering Experiment (ISSI), a project is run by NASA,
is designed to promote understanding of joining techniques, shape
equilibrium, wetting phenomena, and micro-structural development in
space. In earth's gravity, soldering has a defined behavior and is
reliant on gravity and convection to assist in solidification, joint
shape, integrity, and microstructure. To better understand how solder
behaves if processed in space, a systematic series of soldering samples
was designed to investigate and understand porosity development, surface
wetting, and equilibrium shape formation. After the samples were heated
on orbit, they were returned to Earth for property testing and
metallographic examination.
On Earth,
soldering depends on gravity and convection for proper solidification,
joint shape, joint integrity and microstructure. Some detrimental gas
bubbles or void spaces form in the solder joint at contact surfaces.
These voids reduce the thermal and electrical conductivity as well as
provide sites for crack initiation. In the reduced gravity environment
in orbit, bubbles have less chance to escape and weaker joints are more
of a problem than on Earth.
The ISSI
payload provided unique insight into microgravity soldering methods,
which could play a fundamental role in maintaining the International
Space Station as well as provide understanding of repair capabilities on
future missions to the Moon and to Mars.
|
|
|
| More
BEST information |
|
|
