CoolCap™ & CoolShield™ Features and Benefits All devices are reusable. Delivers repeatable performance. Enables fast set up and high rework throughput and yield. Provides up to 60°C temperature reduction for the adjacent component package body. Provides up to 35°C temperature reduction for the protected component solder joints. Prevents secondary reflow. Reduces the need for device-specific rework nozzles. Protects adjacent components from additional stray heat present with non-specific nozzles. Rests directly on the PCB, and does not require the use of adhesive or clean up. 1.5mm wall thickness allows fit despite close component placement. Eliminates undesirable temperature cycling of adjacent components. Compatible with Tin-Lead and Lead-Free rework processes. Back to CoolCap™ Pages     Available Now!  Contact BEST today for answers to your questions. 847.797.9250