CoolCap™ protects adjacent IC components from secondary
solder joint reflow due to stray heat from and during the
pcb rework or repair process.CoolCap™ fits common BGA and
QFP size packages specifically developed for PCB rework
operations.
CoolShield™ protects passives and odd shaped components
against excessive heat that can compromise the device
reliability.
CoolCap™ and CoolShield™ are compatible with both
Tin-Lead and Lead-Free solder rework. |